Polyimide film adhesive tape is a special tape made of polyimide film as the base material and coated with a high-temperature resistant adhesive (such as silicone or acrylic adhesive). It is widely used in harsh environments such as high temperature and high insulation due to its unique properties.

Main features:

1. Excellent high temperature resistance

- Long-term temperature tolerance range: **-269°C to 400°C**, short-term tolerance to higher temperatures (such as 500°C), far exceeding ordinary tapes (such as PVC or PET tapes).

2. Excellent electrical insulation performance

- High dielectric strength (usually >100 kV/mm), low dielectric constant, suitable for high-frequency circuits, flexible printed circuits (FPC) and motor winding insulation protection.

3. Strong chemical stability

- Resistant to solvents, acids and alkalis, can be used stably for a long time in semiconductor manufacturing or chemical environments.

4. Outstanding mechanical properties

- High tensile strength (＞150 MPa), good flexibility, can fit complex curved surfaces without cracking.

5. Low coefficient of thermal expansion (CTE)

- Excellent dimensional stability at high temperature (CTE≈2×10⁻⁶/℃), avoiding displacement due to temperature changes, suitable for precision device fixation.

6. Additional functional characteristics

- Flame retardancy: Meets UL94 V-0 standard, self-extinguishing without open flame.

- Radiation resistance: Anti-ultraviolet and gamma rays, suitable for aerospace or nuclear industry.

- No residual glue design: Some models do not leave residual glue after high temperature removal, protecting sensitive surfaces.

Typical application scenarios:

- Electronic field: PCB welding shielding, lithium battery tab insulation, temporary chip fixation.

- Industrial field: high temperature spray painting/powder spraying shielding, heating element bundling.

- Aerospace: cable insulation, satellite thermal control layer bonding.

- Emerging fields: flexible display manufacturing, new energy vehicle motor insulation.