FEP Film Adhesive Tape for High-Temperature Process Protection on Semiconductors

- Application Scenarios:

   In high-temperature processes during semiconductor manufacturing (such as diffusion, ion implantation, annealing, etc.), FEP tape can be used to protect non-processed areas of the wafer. 

- Advantages: 

High Temperature Resistance: Can withstand temperatures from -200°C to +200°C for extended periods, and can withstand even higher temperatures in short periods. 

Chemical Inertness: Resistant to corrosion from acids, alkalis, and organic solvents (such as photoresist removers), preventing wafer contamination.