Optical‑grade high‑transparency FEP film adhesive tape (F46 fluorinated ethylene‑propylene tape) is constructed with high‑purity optical‑grade FEP fluoroplastic film, featuring visible‑light transmittance up to 95% and ultra‑low haze for excellent visual clarity. The film is treated by plasma activation modification on one‑side, then coated with two types of high‑performance pressure‑sensitive adhesives: silicone pressure‑sensitive adhesive and acrylic pressure‑sensitive adhesive (Huayu flagship grade).
Ultra‑thin substrate customization is available with minimum substrate thickness of 0.025 mm. Custom roll‑slitting and die‑cut sheet‑processing are supported for various widths and thicknesses. The FEP film features excellent chemical inertness, low‑ion‑extraction and low‑outgassing. Combined with 95% optical‑grade transparency, high‑temperature resistance, non‑stick release and anti‑corrosion performance, all adhesive grades are anti‑yellowing. The tape resists adhesive‑failure under heat and delivers clean low‑residue peeling. It is widely deployed for semiconductor packaging, resin‑based 3D‑printing, petrochemical‑oil‑gas industry, optical manufacturing, medical‑biological research and other high‑precision industrial sectors as premium import‑substitution fluoropolymer pressure‑sensitive tape.
Key Product Features
1. Adhesive‑System Performance
Two pressure‑sensitive adhesives cover the vast majority of industrial application scenarios. All adhesives adopt anti‑yellowing formulation to preserve original 95% transparency of film after long‑term service, resisting delamination under high‑temperature processing with residue‑free clean peel‑off. The acrylic pressure‑sensitive adhesive is independently‑developed high‑temperature‑resistant formula by Huayu. It withstands short‑term peak temperature up to 260℃, benchmarking premium‑grade industrial adhesive from Henkel Germany and outperforming ordinary commercial acrylic adhesives for sophisticated hot‑process applications.
‑ Silicone PSA Grade: Superior high‑temperature stability, ultra‑clean peel‑off performance, low out‑gassing and strict ion‑leaching control. Preferred for semiconductor hot‑press and high‑purity high‑temperature release‑protection processes.
‑ Acrylic PSA Grade (Huayu Flagship): Balanced adhesive strength, outstanding weather‑resistance and cost‑effectiveness for most industrial shielding, wrapping, fixing and surface‑protection jobs.
2. Core Substrate Properties
✅ Optical‑grade high‑transparency with 95% light transmittance and ultra‑low haze, enabling direct visual inspection of mold flash overflow and workpiece status for optical and semiconductor visual‑monitoring processes.
✅ Extreme chemical inertness with excellent resistance against acids, alkalis and most organic solvents, no chemical reaction with epoxy, resin and industrial chemical media.
✅ Low‑friction surface with outstanding non‑stick release performance against resin and adhesive residue build‑up.
✅ Stable electrical‑insulation performance. High‑purity film with low‑ion‑leaching and low‑outgassing prevents contamination to precision electronic components.
✅ Broad working‑temperature range with short‑term heat‑resistance up to 260℃. Maintains good toughness without brittleness or deformation across high‑low‑temperature cycles.
✅ Ultra‑thin 0.025 mm minimum substrate thickness delivers excellent conformability onto flat, curved and irregular workpiece surfaces.
Application Fields
1. Semiconductor Chip Packaging
Release‑protection for hot‑press moulding of epoxy plastic encapsulation at 170‑190℃. High‑transparent backing allows real‑time visual check for EMC epoxy flash overflow. Low‑outgassing and low‑ion‑extraction reduce chip‑contamination risk. Clean peeling after hot‑press cuts down mould‑polishing frequency and mitigates flash‑burr defects for precision tooling protection.
2. Petroleum & Oil‑Gas Industry
Protective wrapping for submersible oil‑pumps and oil‑pipeline outer surfaces. Good resistance against hydrocarbon media for outdoor and buried‑pipe service, suitable for overseas oil‑gas pipeline maintenance projects.
3. Resin‑Curing 3D‑Printing
Special release‑layer for LCD / DLP resin printer resin vats. 95% high‑transparency guarantees UV‑light transmission efficiency for smooth resin demoulding, reduces sticking and improves finished‑part yield.
4. Optical Precision Manufacturing
Process isolation and surface protection for optical lenses, acrylic sheets and precision transparent components. It provides anti‑dust, anti‑scratch and anti‑stain protection without impairing optical performance. Also suitable for repairing and protecting damaged ETFE architectural membrane materials.
5. Medical & Biological Chip Research
Isolation protection for bio‑chips and precision‑medical‑device manufacturing. Ultra‑pure, low‑leaching material fits clean‑room research‑production environments for temporary masking and isolation.
6. Advanced General Industrial Applications
Used for temporary masking during high‑temperature processes, release liner for composite hot‑press forming, electrical insulation wrapping and equipment anti‑corrosion protection. Custom die‑cut gaskets and narrow‑width slit rolls are available upon request.