Huayu FEP Film Adhesive Tape (F46 fluorinated ethylene propylene tape) is made of optical‑grade highly transparent FEP film with a light transmittance of 95%. After precise single‑side activation treatment, the film is coated with two high‑performance adhesives: silicone pressure‑sensitive adhesive and acrylic pressure‑sensitive adhesive (main grade).
The product supports ultra‑thin customization with a minimum substrate thickness of 0.05 mm. Roll slitting and die‑cut sheet processing are available in customized sizes. Featuring ultra‑low haze, low ion precipitation, low outgassing, excellent chemical inertness, high temperature resistance, non‑stick release performance and stable insulation, the tape peels off cleanly at high temperatures. It is widely used in semiconductor packaging, optical processing, 3D printing, petrochemical engineering, medical research and other high‑precision industries as a reliable import‑substitution fluorine plastic film tape.
Key Product Features
1. Adhesive Options
Two pressure‑sensitive adhesives cover the vast majority of industrial application scenarios. All adhesive grades feature anti‑yellowing property, maintaining the substrate’s original 95% transparency over time. They resist adhesive failure under heat and deliver residue‑free clean peel‑off.
Among them, the acrylic pressure‑sensitive adhesive is an independently‑developed high‑temperature‑resistant formula by Huayu. It can withstand temperatures up to 260℃, with performance benchmarked against premium‑grade industrial adhesive from Henkel Germany and superior thermal stability compared with ordinary commercial adhesives for high‑end precision hot‑process applications.
• Silicone PSA Grade: Excellent high‑temperature stability, ultra‑clean peeling performance, low outgassing and strict ion control. Ideal for semiconductor hot pressing and high‑precision clean release processes.
• Acrylic PSA Grade (Huayu Main Grade): Balanced adhesion strength, excellent weather resistance and cost‑performance, suitable for most industrial shielding, wrapping, fixing and protection applications.
2. Core Substrate Advantages
✅ Optical‑grade high transparency with 95% light transmittance and ultra‑low haze, enabling visual inspection of mold overflow and internal processing status for precision optical production.
✅ Extremely high chemical inertness, resistant to acids, alkalis, solvents and corrosion.
✅ Low friction surface with excellent non‑stick release performance against resin and adhesive materials.
✅ Stable electrical insulation performance with low ion precipitation and low outgassing to protect precision electronic components.
✅ Excellent temperature resistance up to 260℃ short‑term, maintaining stable toughness under high and low temperature conditions.
✅ Ultra‑thin 0.05 mm thickness provides excellent conformability on flat, curved and irregular surfaces.
Application Fields
1. Semiconductor Chip Packaging
Suitable for 170–190℃ plastic sealing hot pressing processes. 95% high transparency allows real‑time process observation. Low outgassing and clean peeling reduce mold wear and improve product yield.
2. Petroleum & Oil‑Gas Industry
Protective wrapping for submersible oil pumps and oil pipelines. Excellent corrosion resistance for long‑term outdoor, buried and large‑scale overseas oil and gas projects.
3. Resin 3D Printing Industry
Professional release material for LCD and DLP resin printer vats. High light transmittance ensures stable light penetration, smooth demolding and improved printing accuracy.
4. Optical Precision Manufacturing
Surface protection and isolation for optical lenses, acrylic sheets and transparent precision components without affecting optical performance.
5. Medical & Biological Research
Clean isolation protection for bio‑chips and precision medical devices with low‑precipitation pure material suitable for high‑standard laboratory environments.
6. Advanced General Industrial Applications
Widely used in high‑temperature masking, composite hot‑press release, electrical insulation wrapping and anti‑corrosion protection. Custom die‑cutting and narrow slitting processing are available.
Selection Guide
• High‑temperature, semiconductor and ultra‑clean processes: Silicone PSA FEP Tape
• General industrial protection and mass production: Acrylic PSA FEP Tape (Recommended)
Custom sizes and full deep processing services are supported, with complete English and Chinese technical documents provided.